Semiconductor Packaging Inspection Equipment Structural Components

Manufacturing high-precision, high-stability core mechanical structural components and modules for semiconductor packaging inspection equipment.

Material: ·Structural steel and electronic components
Process:
·Precision sheet metal forming and welding. ·CNC 3-axis and surface milling machine precision machining. ·Component casting and multi-process parts integration. ·Modular pre-assembly and precision debugging.
Key Features:
·High-Precision Platform Manufacturing: Provides a critical support platform for inspection equipment, with overall flatness controllable within < 0.1mm, meeting stringent optical inspection benchmark requirements. ·Complex Component Integration Capability: Supplies complex structural modules integrated from over 200 independent parts (including sheet metal, machined, cast, and electronic components), demonstrating multi-process collaborative manufacturing strength. ·Precision Assurance for Critical Dimensions: High machining accuracy for core structural components, achieving parallelism up to 0.02mm, ensuring the precision and stability of the equipment's motion mechanisms. ·Full-Process Traceable Quality Control: Under a strict quality management system, achieves full-process quality control and traceability from raw materials to finished modules.

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